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Performance Cable Systems & Materials Division
Packaging Materials
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Providing a full range of services, from packaging materials and mounting techniques, featuring TAB tape. |
In the semiconductor packaging field, Leadframes and TAB tapes are available for high-density ICs. Hitachi Cable has extensive knowledge on the potential of ICs, and has established an integrated system covering the entire production and business process, from customer design to mass production. Device production is administered by an intensive production and supply system in Japan as well as in Singapore and Malaysia, which covers the Southeast Asia region, the center of semiconductor production. |
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TAB tapes for LCD drivers
(Packaging Material) |
In semiconductor packaging, TAB tape carriers and rigid substrates are available for super compact semiconductor packages. We are developing packaging materials for liquid crystal drives and graphic processing devices. TAB tape, which enables fine and complicated wiring of wafers, has attracted the attention of the Chip Scale Package (CSP) mainstream semiconductor packaging market.
Hitachi Cable was one of the first in the industry to establish mass-production technology for TAB tape carriers for semiconductors, and has supplied packages for flash memories and high-speed graphic processing for personal computers, cellular phones. We have built on this breakthrough to develop other next-generation technologies, including a rigid substrate.
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Packaging materials |
Interposer tapes for CSP. BGA/ TAB tapes for LCD drivers/ Rigid tapes for IC cards/ Tapes with bumps for LSI test sockets/ LOC leadframes for DRAMs/ Leadframes for transistors/ Copper alloy wires and strips for electronic components |
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µBGA package
* µBGA is a registered trademark of Tessera,Inc. U.S.A. |
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Contact Us |
If you have any inquires for our packaging products, please feel free to contact us.
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