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Cu Strip for Lead Frame
Theme is supplying material to Customer needs
SH Copper Product’s theme is “Material Application Just Fit for Customer’s Use”.
To meet today’s incessantly changing and diversifying needs, based on the theme “Material Application Just Fit for Customer’s Use”, by uniting our wide line-up of copper and copper alloys to our metal fabrication technologies, such as dual gauge processing and foil fabrication, we support the evolution of the electronic industry.
At SH Copper Products, for Cu Strips for semiconductor lead frame, oxygen free Cu based alloys are available for discrete, transistor and IC’s and unique high strength, high electrical conductivity alloys are made available for high pin count LSI.
Cu Alloy strips to back up the electronic technology
Cu Alloys of SH Copper Products
Cu alloy for semiconductor lead frame, from discrete to LSI
C1020
Outline
By the recent high integration of IC chips, the heat emission has increased and in order to suppress the temperature, packages with heat sink are becoming more and more. For heat sink, material with the highest thermal conductivity, oxygen free copper is usually selected. SH Copper is the world’s largest oxygen free copper manufacturer and supply oxygen free copper strip for heat sink all globally.
Compared to tough pitch copper, it is superior in thermal conductivity, electrical conductivity and formability, being the standard material widely used for heat sink application.
Characteristic
（1）High quality, High Purity oxygen free copper(C10200) is applied.
（2）Ultra high purity oxygen free copper(C10100, Cu above 99.99%) strip is also available.
Standard Size
Thickness: 0.1 to 3.0mm
Width: max.550mm
Chemical composition（wt%）
| Cu |
|---|
| 99.96min |
physical properties
| Coefficient of thermal expansion（10-6/K） | 17.7 |
|---|---|
| Specific gravity（g/㎤） | 8.94 |
| Volume resistivity（μΩ・m） | 0.0171 |
| Longitudinal elastic modulus（N/㎟） | 118000 |
| Thermal conductivity（W/m・K） | 391 |
| Conductivity（%IACS） | 97min |
Mechanical characteristic
| Temper | O | 1/4H | 1/2H | H |
|---|---|---|---|---|
| Tensile strength（N/㎟） | 195min | 215〜275 | 245〜315 | 275min |
| stretching（%） | 35min | 25min | 15min | 2min |
| Hardness（MHv） | 45〜75 | 60〜90 | 75〜105 | 95〜125 |
HCL-12S
Outline
HCL-12S is a copper alloy for lead frame material for small signal transistor and power transistor used widely, worldwide.
By adding small amount of tin to our high purity oxygen free copper, HCL-12S retains the softening resistance as a lead frame material keeping the superior properties of oxygen free copper having good cost performance. It is used also for widely in the field of contacts in circuitry, such as relay, switches.
Characteristics
（1）By the small additive of Tin, HCL-12S retains marginable softening resistance from heat.
（2）HCL-12S having the superior electrical conductivity, adhesiveness of surface oxides of oxygen free copper is also a good cost performance material.
Chemical composition（wt%）
| Cu+Sn | Sn |
|---|---|
| 99.96min | 0.10〜0.15 |
physical properties
| Coefficient of thermal expansion（10-6/K） | 17.7 |
|---|---|
| Specific gravity（g/㎤） | 8.90 |
| Volume resistivity（μΩ・m） | 0.019 |
| Longitudinal elastic modulus（N/㎟） | 118000 |
| Thermal conductivity（W/m・K） | 360 |
| Conductivity（%IACS） | 85min |
Mechanical characteristic
| Temper | 1/2H | H |
|---|---|---|
| Tensile strength（N/㎟） | 275〜360 | 315min |
| stretching（%） | 6min | 2min |
| Hardness（MHv） | 85〜110 | 100〜130 |
HCL-02Z
Outline
HCL-02Z is not only used for discrete packages for small signal transistors or power transistors but also used for IC’s, TBGA stiffeners based with superior properties, used for various types of lead frames. HCL-02Z, by adding Zr to high purity oxygen free Cu, it incorporates high heat/softening resistance, thus taking advantage of superior properties of oxygen free copper, it is attracting great attention as a non-plated lead frame material. It is used also for widely in the field of contacts in circuitry, such as relay, switches.
Characteristics
（1）HCL-02Z has high heat/softening resistivity by the small addition of Zr.
（2）HCL-02Z retains superior properties of oxide adhesiveness, resin adhesiveness, direct wire bond-ability and plate-ability of oxygen free copper.
（3）It is also used widely for TBGA stiffeners and power QFN.
Chemical composition（wt%）
| Cu+Zr | Zr |
|---|---|
| 99.96min | 0.015〜0.03 |
physical properties
| Coefficient of thermal expansion（10-6/K） | 17.7 |
|---|---|
| Specific gravity（g/㎤） | 8.90 |
| Volume resistivity（μΩ・m） | 0.018 |
| Longitudinal elastic modulus（N/㎟） | 121000 |
| Thermal conductivity（W/m・K） | 373 |
| Conductivity（%IACS） | 94min |
Mechanical characteristic
| Temper | 1/2H | H | SH |
|---|---|---|---|
| Tensile strength（N/㎟） | 275〜360 | 315min | 400min |
| stretching（%） | 6min | 2min | 2min |
| Hardness（MHv） | 85〜110 | 100〜130 | 125〜145 |
Resin adhesion test
Direct wire bonding test
Heat resistance of the C151, HCL-02Z
C151
Outline
C151 is a standard material for PLCC packages equivalent to CDA15100 and one of the favorite Cu alloys in SH Copper Products. For the high heating softening resistivity and superior surface treatment properties, recently, it is gaining attention for the use in TBGA stiffeners, as same as HCL-02Z.
Characteristics
（1）C151-3/4H is supplied to worldwide users for PLCC lead frame material.
（2）C151-SH is an unique material having high strength, high electrical conductivity and characteristics of oxygen free copper.
Chemical composition（wt%）
| Cu+Zr | Zr | Mn | Al |
|---|---|---|---|
| 99.96min | 0.05〜0.15 | 0.005max | 0.005max |
physical properties
| Coefficient of thermal expansion（10-6/K） | 17.7 |
|---|---|
| Specific gravity（g/㎤） | 8.90 |
| Volume resistivity（μΩ・m） | 0.018 |
| Longitudinal elastic modulus（N/㎟） | 121000 |
| Thermal conductivity（W/m・K） | 360 |
| Conductivity（%IACS） | 90min |
Mechanical characteristic
| Temper | 3/4H | H | SH | ESH |
|---|---|---|---|---|
| Tensile strength（N/㎟） | 320〜385 | 365〜430 | 400min | 425〜485 |
| stretching（%） | 5min | 4min | 2min | |
| Hardness（MHv） | 100〜125 | 115〜135 | 125〜150 |
Heat resistance of the C151, HCL-02Z
C194
Outline
C194(CDA19400) is a copper alloy which has high strength with superior stamping properties and is applied to IC lead frames and connectors all over the world. With better plating properties, etching properties and stamping properties, it is evaluated highly among the customers.
Characteristics
（1）Our C194 has finer precipitates good for better plating and etching properties.
（2）Our C194 has higher heat/softening resistance and offers much higher stamping efficiency.
Chemical composition（wt%）
| Fe | Zn | P | Cu |
|---|---|---|---|
| 2.1〜2.6 | 0.05〜0.20 | 0.015〜0.15 | 97min |
physical properties
| Coefficient of thermal expansion（10-6/K） | 17.7 |
|---|---|
| Specific gravity（g/㎤） | 8.8 |
| Volume resistivity（μΩ・m） | 0.025 |
| Longitudinal elastic modulus（N/㎟） | 123000 |
| Thermal conductivity（W/m・K） | 230min |
| Conductivity（%IACS） | 60min |
Mechanical characteristic
| Temper | 1/2H | H | SH | ESH |
|---|---|---|---|---|
| Tensile strength（N/㎟） | 365〜435 | 415〜485 | 480〜525 | 520〜590 |
| stretching（%） | 5min | 2min | 4min | 5min |
| Hardness（MHv） | 115〜137 | 125〜145 | 140〜155 | 150〜170 |
Temper：H、ESHの耐熱性
HCL-305-1/2H(for lead frame)
Outline
HCL-305 is a precipitation hardening Corson type alloy, well suited for tiny SOT packages for mini mold transistors used in recent mobile devices.
Characteristics
（1）HCL-305 has strength comparable to alloy 42 with elongation over 10%, which can endure the severe lead forming of tiny SOT packages.
（2）By adding Zn, high adhesiveness to resin is achieved, offering much better reliability.
Chemical composition（wt%）
| Ni | Si | Zn | P | Cu |
|---|---|---|---|---|
| 2.2〜2.8 | 0.3〜0.7 | 1.5〜2.0 | 0.015〜0.06 | 残 |
physical properties
| Coefficient of thermal expansion（10-6/K） | 17.4 |
|---|---|
| Specific gravity（g/㎤） | 8.9 |
| Volume resistivity（μΩ・m） | 0.0410 |
| Longitudinal elastic modulus（N/㎟） | 116000 |
| Thermal conductivity（W/m・K） | 110 |
| Conductivity（%IACS） | 25min |
Mechanical characteristic
| Temper | 1/2H |
|---|---|
| Tensile strength（N/㎟） | 500〜650 |
| stretching（%） | 8min |
| Hardness（MHv） | 160〜210 |
Resin adhesion test
HCL-64T
Outline
HCL-64T is a Cu Alloy which has been licensed by Furukawa Electric Co., and fabricated and marketed by SH Copper Products and standardized as CDA18045. This alloy has high strength and high electrical conductivity used for variety of packages such as QFP, SOP and mini mold transistors.
Characteristics
This Cu alloy having both high strength and electrical conductivity is well balanced and suited for thin, high pin count QFP and SOP lead frames. It also has superior properties required in manufacturing of lead frames and IC assembly.
Chemical composition（wt%）
| Cr | Sn | Zn | Cu |
|---|---|---|---|
| 0.20〜0.30 | 0.23〜0.27 | 0.18〜0.26 | 残 |
physical properties
| Coefficient of thermal expansion（10-6/K） | 17.0 |
|---|---|
| Specific gravity（g/㎤） | 8.90 |
| Volume resistivity（μΩ・m） | 0.023 |
| Longitudinal elastic modulus（N/㎟） | 127000 |
| Thermal conductivity（W/m・K） | 301 |
| Conductivity（%IACS） | 71min |
Mechanical characteristic
| Temper | 1/2H |
|---|---|
| Tensile strength（N/㎟） | 490〜588 |
| stretching（%） | 10min |
| Hardness（MHv） | 160〜195 |
